{"id":1867,"date":"2014-02-20T16:39:59","date_gmt":"2014-02-21T00:39:59","guid":{"rendered":"http:\/\/blogs.oregonstate.edu\/erlenmeyer\/?p=1867"},"modified":"2014-02-21T08:14:11","modified_gmt":"2014-02-21T16:14:11","slug":"inpria-raises-7-3-million","status":"publish","type":"post","link":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/2014\/02\/20\/inpria-raises-7-3-million\/","title":{"rendered":"Inpria Raises $7.3 Million from Samsung, Intel"},"content":{"rendered":"<figure id=\"attachment_1868\" class=\"wp-caption thumbnail alignleft\" style=\"width: 300px;\">\n    <a href=\"http:\/\/blogs.oregonstate.edu\/erlenmeyer\/files\/2014\/02\/Grenville-Andrew-The-Oregonian-prop.-of-OSU.jpeg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-1868\" alt=\"Inpria CEO Andrew Grenville\" src=\"http:\/\/blogs.oregonstate.edu\/erlenmeyer\/files\/2014\/02\/Grenville-Andrew-The-Oregonian-prop.-of-OSU-300x204.jpeg\" width=\"300\" height=\"204\" \/><\/a>\n    <figcaption class=\"wp-caption-text\">Inpria CEO Andrew Grenville in their Corvallis Lab (Photo via The Oregonian, property of Oregon State University)<\/figcaption>\n    <\/figure>\n<p>Originally printed in <a title=\"The Oregonian\" href=\"http:\/\/www.oregonlive.com\/silicon-forest\/index.ssf\/2014\/02\/corvallis_semiconductor_equipm.html\" target=\"_blank\">The Oregonian<\/a> | Written by: <a title=\"Mike Rogoway Email\" href=\"mailto:mrogoway@oregonian.com\" target=\"_blank\">Mike Rogoway<\/a> | Used with Permission<\/p>\n<p>Your livelier laptops, smarter smartphones and quicker tablets all improve, fundamentally, because the computer circuitry inside is always shrinking. Every two years or so, smaller features enable chipmakers to pack more transistors onto a chip \u2013 thereby improving performance.<\/p>\n<p>But there\u2019s a big problem with small: Features are becoming so tiny that <a href=\"http:\/\/www.oregonlive.com\/silicon-forest\/index.ssf\/2013\/11\/intel_faces_technical_and_econ.html\">existing technologies can\u2019t reliably manufacture them<\/a>. New production equipment \u2013 notably a lithography tool known as extreme ultraviolet (EUV) \u2013 promise better results, but <a href=\"http:\/\/www.oregonlive.com\/silicon-forest\/index.ssf\/2013\/10\/gartner_chip_industry_tracking.html\">have been frustratingly slow to materialize<\/a>.<\/p>\n<p>So two of the world\u2019s biggest chipmakers, and the industry\u2019s biggest equipment manufacturer \u2013 are investing $7.3 million in a Corvallis startup called <a href=\"http:\/\/www.inpria.com\/\">Inpria Corp<\/a>. The 12-person company, which spun out of Oregon State University in 2007, has new chemical technology designed to improve chip lithography and enable EUV.\u00a0 <a title=\"Full article\" href=\"http:\/\/www.oregonlive.com\/silicon-forest\/index.ssf\/2014\/02\/corvallis_semiconductor_equipm.html\" target=\"_blank\">Read more&#8230;<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Originally printed in The Oregonian | Written by: Mike Rogoway | Used with Permission Your livelier laptops, smarter smartphones and quicker tablets all improve, fundamentally, because the computer circuitry inside is always shrinking. Every two years or so, smaller features enable chipmakers to pack more transistors onto a chip \u2013 thereby improving performance. But there\u2019s&hellip; <a href=\"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/2014\/02\/20\/inpria-raises-7-3-million\/\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":3656,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[101481],"tags":[199217,603,199216,2495,199221,199220,135411],"class_list":["post-1867","post","type-post","status-publish","format-standard","hentry","category-research-2","tag-andrew-grenville","tag-chemistry","tag-inpria","tag-intel","tag-mike-rogoway","tag-oregonian","tag-samsung"],"_links":{"self":[{"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/1867","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/users\/3656"}],"replies":[{"embeddable":true,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/comments?post=1867"}],"version-history":[{"count":6,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/1867\/revisions"}],"predecessor-version":[{"id":1883,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/1867\/revisions\/1883"}],"wp:attachment":[{"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/media?parent=1867"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/categories?post=1867"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/dev.blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/tags?post=1867"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}