Applied Materials has an opening for a Materials Characterization Intern, who will focus on structural characterization of MRAM and FINFET multi-laywer films by FIB and TEM. A project on 3D imaging and tomographic reconstruction using FIB/SEM will be completed within the intern term.
They are looking for an undergraduate or graduate student in materials science, chemistry, electrical engineering or physics.
The hourly rate will be ~$18-20/hour.
Please share the attached job description with your students. They need to fill the position immediately.
Brief description from the company contact:
“We mainly provide TEM/FIB analysis to Intel and support their R & D projects. To address customers’ increasing TEM/FIB requests and fast turnaround expectations, we are expanding our team and recruiting an intern to focus on TEM sample preparation by hands-on operation of the FIB/SEM dual beam system. Our TEM/FIB lab is equipped with a state-of-the-art FEI Osiris TEM and an Helios 600 FIB/SEM.
If your students and graduates are interested in this position or are looking for an opportunity to get professional TEM/FIB experience in a world-famous semiconductor company, please encourage them to apply. This position needs to be filled in immediately. Thanks a lot.”
Contact Ming Zhang at Ming_Zhang@amat.com for details on how to apply, if interested in this internship opportunity.